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ESD9P5.0ST5G
PACKAGE DIMENSIONS
SOD ? 923
CASE 514AB
ISSUE C
2X b
0.08 X Y
c
1
D
TOP VIEW
H E
? X ?
E
2
? Y ?
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
MILLIMETERS INCHES
DIM  MIN   NOM  MAX   MIN   NOM  MAX
A 0.34 0.37 0.40 0.013 0.015 0.016
b 0.15 0.20 0.25 0.006 0.008 0.010
c 0.07 0.12 0.17 0.003 0.005 0.007
D 0.75 0.80 0.85 0.030 0.031 0.033
E 0.55 0.60 0.65 0.022 0.024 0.026
H E 0.95   1.00   1.05   0.037  0.039  0.041
L 0.19 REF 0.007 REF
L2 0.05   0.10   0.15   0.002  0.004  0.006
SIDE VIEW
SOLDERING FOOTPRINT*
2X
L
2X
0.36
1.20
2X
0.25
2X
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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ESD9P5.0S/D
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